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TDA1557Q/N2,112 - NXP

Description: Audio Amplifiers 2X22 W BTL AUDIO

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PCB Footprints
TDA1557Q/N2,112 - NXP PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - SOT141-6-ren2
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3D Models
TDA1557Q/N2,112 - NXP  - 3D model - Transistor Outline, Vertical - SOT141-6-ren2
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TDA1557Q/N2,112 Details

  • Manufacturer Part Number:

    TDA1557Q/N2,112

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SIP

  • Package Description:

    POWER, PLASTIC, SOT-141R, SIP-13

  • Pin Count:

    13

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • Gain:

    46 dB

  • Harmonic Distortion:

    0.1%

  • JESD-30 Code:

    R-PZIP-T13

  • JESD-609 Code:

    e3

  • Length:

    24 mm

  • Number of Channels:

    2

  • Number of Terminals:

    13

  • Output Power-Nom:

    22 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    ZIP

  • Package Equivalence Code:

    SIP13,.2

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    17 mm

  • Supply Current-Max:

    160 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.7 mm

  • Terminal Position:

    ZIG-ZAG

  • Width:

    4.4 mm

TDA1557Q/N2,112 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA1557Q/N2,112 should ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a solid copper plane on the bottom layer of the PCB.
  • To ensure EMC, it is recommended to use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite bead to filter out electromagnetic interference (EMI). Additionally, ensure that the power supply lines are decoupled and filtered properly.
  • A decoupling capacitor of 10 uF to 22 uF should be placed as close as possible to the power pins of the TDA1557Q/N2,112. Additionally, a 100 nF to 220 nF capacitor can be used in parallel to filter out high-frequency noise.
  • A voltage supervisor or a reset IC can be used to monitor the power supply voltage and reset the system in case of an overvoltage or undervoltage condition. Additionally, a voltage regulator with overvoltage protection can be used to regulate the power supply voltage.
  • A heat sink can be attached to the package to improve thermal dissipation. The heat sink should be designed to have a thermal resistance of less than 10°C/W. Additionally, a thermal interface material (TIM) can be used to improve the thermal contact between the package and the heat sink.

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TDA1557Q/N2,112 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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