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TDA4VE88TGAALZRQ1 - Texas Instruments

Description: Microprocessors - MPU Automotive system-on-a-chip for autoparking and driver assist with AI, vision pre-processing and GPU

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TDA4VE88TGAALZRQ1 - Texas Instruments PCB footprint - BGA - BGA - ALZ0770A
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TDA4VE88TGAALZRQ1 - Texas Instruments  - 3D model - BGA - ALZ0770A
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TDA4VE88TGAALZRQ1 Details

  • Manufacturer Part Number:

    TDA4VE88TGAALZRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.50

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PBGA-B770

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    770

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA770,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100; ISO 26262

  • Seated Height-Max:

    2.57 mm

  • Speed:

    2000 MHz

  • Supply Voltage-Max:

    0.84 V

  • Supply Voltage-Min:

    0.76 V

  • Supply Voltage-Nom:

    0.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

TDA4VE88TGAALZRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal design guide in the TDA4VE88TGAALZRQ1 Hardware Design Guide (SWRU623) and the TDA4VE88TGAALZRQ1 Thermal Design Guide (SWRU624). These guides provide detailed information on PCB layout, thermal management, and heat sink design to ensure optimal performance and heat dissipation.
  • To optimize power consumption, engineers can use the Power Management IC (PMIC) integrated into the TDA4VE88TGAALZRQ1 to dynamically adjust voltage and frequency scaling. Additionally, using low-power modes, such as sleep mode or standby mode, can reduce power consumption when the device is not in use. Texas Instruments provides a Power Management Guide (SWRU625) that provides detailed information on power optimization techniques.
  • The recommended operating conditions for the TDA4VE88TGAALZRQ1 are specified in the datasheet, including temperature range, voltage supply, and clock frequency. To ensure reliable operation, engineers should follow the recommended operating conditions, use proper power sequencing, and ensure that the device is properly decoupled and filtered. Texas Instruments provides a Reliability and Quality Guide (SWRU626) that provides detailed information on ensuring reliable operation.
  • Texas Instruments provides a range of debugging tools and resources, including the XDS560v2 emulator, the Code Composer Studio (CCS) integrated development environment, and the TDA4VE88TGAALZRQ1 Debug and Troubleshooting Guide (SWRU627). These resources provide detailed information on troubleshooting and debugging techniques, including how to use debug interfaces, analyze system logs, and identify and fix common issues.
  • The TDA4VE88TGAALZRQ1 has a range of security features, including secure boot, secure firmware updates, and cryptographic acceleration. Texas Instruments provides a Security Guide (SWRU628) that provides detailed information on implementing secure boot and secure firmware updates, including how to use the device's security features, such as the Secure Boot Loader and the Firmware Update Manager.

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TDA4VE88TGAALZRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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