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TDA5211 - Infineon

Description: ASK/FSK SINGLE CONVERSION RECEIVER, PDSO28

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PCB Footprints
TDA5211 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TSSOP-28
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3D Models
TDA5211 - Infineon  - 3D model - Small Outline Packages - PG-TSSOP-28
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TDA5211 Details

  • Manufacturer Part Number:

    TDA5211

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    PLASTIC, TSSOP-28

  • Pin Count:

    28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G28

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    0.0075 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

TDA5211 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA5211 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the antenna. Additionally, using a shielded enclosure and keeping the PCB away from other noise sources can help minimize EMI.
  • To optimize the TDA5211's performance, you should consider factors such as the antenna design, PCB layout, and component selection. You may also need to adjust the device's configuration registers and calibration settings to achieve optimal performance for your specific application.
  • The TDA5211 has a maximum junction temperature of 150°C. To ensure reliable operation, you should ensure good heat dissipation by using a heat sink, thermal interface material, and a well-designed PCB layout that allows for adequate airflow.
  • To troubleshoot issues with the TDA5211, start by checking the device's configuration and calibration settings. Verify that the power supply and clock signals are stable and within the recommended specifications. Use a logic analyzer or oscilloscope to monitor the device's signals and identify any anomalies.
  • When using the TDA5211 in a high-reliability or safety-critical application, you should consider implementing redundant systems, error detection and correction mechanisms, and fail-safe defaults. Additionally, ensure that the device is properly validated and tested for the specific application.

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TDA5211 Overview

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Part Image TDA5211XUMA1 Infineon Technologies AG

Telecom Circuit, 1-Func, PDSO28