Part Image

TDA7200XUMA1 - Infineon

Description: Infineon TDA7200XUMA1 RF Receiver, 28-Pin TSSOP

Download TDA7200XUMA1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TDA7200XUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TSSOP-28_1
click to zoom
3D Models
TDA7200XUMA1 - Infineon  - 3D model - Small Outline Packages - PG-TSSOP-28_1
click to zoom

TDA7200XUMA1 Details

  • Manufacturer Part Number:

    TDA7200XUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    GREEN, PLASTIC, TSSOP-28

  • Pin Count:

    28

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

TDA7200XUMA1 Frequently Asked Questions (FAQs)

  • A good thermal design should be used to ensure optimal heat dissipation. A minimum of 2oz copper thickness is recommended, and thermal vias should be placed under the device to dissipate heat efficiently.
  • To ensure EMC, use a shielded cable for the audio input, keep the audio input and output traces as short as possible, and use a common-mode choke to filter out electromagnetic interference.
  • The recommended power-up sequence is to first apply the analog supply voltage (VCC) and then the digital supply voltage (VDD). This ensures that the analog circuitry is powered up before the digital circuitry.
  • Use a logic analyzer or oscilloscope to check the digital signals, and a multimeter to check the analog signals. Also, check the power supply voltages and decoupling capacitors to ensure they are within the recommended specifications.
  • The maximum allowed capacitance for the input and output coupling capacitors is 10uF. Exceeding this value may affect the device's performance and stability.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TDA7200XUMA1 Overview

Use the download button to access the TDA7200XUMA1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TDA72, or try a keyword search, such as Other Telecom ICs

Parts related to TDA7200XUMA1

Showing 0 results