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TDA7491HVU13TR - STMicroelectronics

Description: 20 W + 20 W dual BTL class-D audio amplifier

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TDA7491HVU13TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSSO-36 EPU_22
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TDA7491HVU13TR - STMicroelectronics  - 3D model - Small Outline Packages - PowerSSO-36 EPU_22
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TDA7491HVU13TR Details

  • Manufacturer Part Number:

    TDA7491HVU13TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-36

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2018-10-19

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    32 dB

  • Harmonic Distortion:

    0.1%

  • JESD-30 Code:

    R-PDSO-G36

  • Length:

    10.3 mm

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    20 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP36,.4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Seated Height-Max:

    2.45 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

TDA7491HVU13TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the TDA7491HVU13TR near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. The datasheet provides a recommended PCB layout, but it's essential to consult with a thermal expert or use thermal simulation tools to optimize the design.
  • To ensure stability and prevent oscillations, it's crucial to follow the recommended component values and PCB layout guidelines in the datasheet. Additionally, ensure that the input and output capacitors are of high quality and have low equivalent series resistance (ESR). A well-designed PCB layout with minimal parasitic inductance and capacitance also helps to prevent oscillations.
  • A good power supply decoupling scheme involves using a combination of ceramic and electrolytic capacitors with different values to filter out high-frequency noise and ripple. A 10uF ceramic capacitor and a 100uF electrolytic capacitor in parallel, placed close to the device's power pins, can provide effective decoupling. However, the optimal decoupling scheme may vary depending on the specific application and PCB layout.
  • To protect the TDA7491HVU13TR from overvoltage and overcurrent conditions, consider adding overvoltage protection (OVP) and overcurrent protection (OCP) circuits. OVP can be achieved using a voltage supervisor or a zener diode, while OCP can be implemented using a current sense resistor and a comparator. Additionally, ensure that the device is operated within its recommended operating conditions and that the power supply is well-regulated.
  • A good thermal management strategy involves ensuring good airflow around the device, using a heat sink with a thermal interface material (TIM), and optimizing the PCB layout for thermal performance. The datasheet provides a thermal resistance (RthJA) value, which can be used to estimate the device's junction temperature. However, it's essential to perform thermal simulations and testing to validate the thermal design.

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TDA7491HVU13TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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