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TDA7492MV13TR - STMicroelectronics

Description: 50 W mono BTL class-D audio amplifier

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TDA7492MV13TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSSO-36 EPD
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TDA7492MV13TR - STMicroelectronics  - 3D model - Small Outline Packages - PowerSSO-36 EPD
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TDA7492MV13TR Details

  • Manufacturer Part Number:

    TDA7492MV13TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    ROHS COMPLIANT, SSOP-36

  • Pin Count:

    36

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    33.6 dB

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    70 °C

  • Output Power-Nom:

    50 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP36,.4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.47 mm

  • Supply Current-Max:

    35 mA

  • Supply Voltage-Max (Vsup):

    26 V

  • Supply Voltage-Min (Vsup):

    10 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

TDA7492MV13TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA7492MV13TR involves keeping the power supply lines as short as possible, using a star-ground configuration, and placing the decoupling capacitors close to the IC. A 4-layer PCB with a dedicated ground plane is recommended.
  • To optimize thermal performance, ensure good airflow around the IC, use a heat sink if possible, and avoid blocking the thermal pads on the underside of the IC. A thermal interface material can also be used to improve heat transfer.
  • The recommended input capacitor value is 220nF to 470nF, depending on the input voltage and frequency. A higher value can be used for lower input frequencies, but may affect the amplifier's stability.
  • Use a voltage regulator or a voltage supervisor to regulate the input voltage and prevent overvoltage conditions. For undervoltage protection, use a voltage supervisor or a reset IC to reset the system when the input voltage falls below a certain threshold.
  • The maximum power dissipation of the TDA7492MV13TR is 30W, but this can be affected by the ambient temperature, PCB layout, and heat sink design. Ensure that the IC is operated within its recommended operating conditions to prevent overheating.

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TDA7492MV13TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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