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TDA8950J/N1,112 - NXP

Description: IC AMP D MONO/STEREO 340W DBS23P

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TDA8950J/N1,112 - NXP PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - DBS23P
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TDA8950J/N1,112 - NXP  - 3D model - Transistor Outline, Vertical - DBS23P
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TDA8950J/N1,112 Details

  • Manufacturer Part Number:

    TDA8950J/N1,112

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    ZIP

  • Package Description:

    PLASTIC, SOT411-1, DIL-BENT-SIL, 23 PIN

  • Pin Count:

    23

  • Manufacturer Package Code:

    SOT411-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    30 dB

  • Harmonic Distortion:

    0.05%

  • JESD-30 Code:

    R-PZIP-T23

  • JESD-609 Code:

    e3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    23

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    170 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    ZIP

  • Package Equivalence Code:

    ZIP23,.2,.17

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    75 mA

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    12.5 V

  • Surface Mount:

    NO

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    ZIG-ZAG

TDA8950J/N1,112 Frequently Asked Questions (FAQs)

  • A good thermal design should be used to ensure the device operates within the recommended temperature range. A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a metal plate to dissipate heat efficiently.
  • To ensure stability, a compensation network consisting of resistors and capacitors should be added between the output and the negative input. The values of these components depend on the specific application and can be calculated using the datasheet's stability analysis guidelines.
  • A decoupling capacitor of at least 10uF should be placed close to the device's power pins (VCC and GND) to filter out high-frequency noise and ensure stable operation. Additional decoupling capacitors can be added at the input and output stages for further noise reduction.
  • TVS (Transient Voltage Suppressor) diodes or ESD protection devices can be added to the input and output stages to protect the amplifier from overvoltage and ESD events. Additionally, a fuse or a PTC (Positive Temperature Coefficient) thermistor can be used to protect the device from overcurrent conditions.
  • The mute pin should be asserted at least 10ms before the amplifier is powered down to prevent audible clicks or pops. The recommended mute sequence is: assert mute, wait 10ms, power down the amplifier, and then remove the input signal.

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TDA8950J/N1,112 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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