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TDE1707CFP - STMicroelectronics

Description: 0.5 A Intelligent Power Switch

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TDE1707CFP - STMicroelectronics - PCB symbol
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TDE1707CFP - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO 8_1
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TDE1707CFP - STMicroelectronics - 3D model - Small Outline Packages - SO 8_1
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TDE1707CFP Details

  • Manufacturer Part Number:

    TDE1707CFP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    48 V

  • Supply Voltage-Min (Vsup):

    6 V

  • Supply Voltage-Nom (Vsup):

    24 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

TDE1707CFP Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN4921, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • The power dissipation of the TDE1707CFP can be calculated using the formula Pd = (Vin x Iin) + (Vout x Iout), where Vin is the input voltage, Iin is the input current, Vout is the output voltage, and Iout is the output current. Additionally, the datasheet provides a power dissipation curve that can be used to estimate the power dissipation based on the output current.
  • The maximum junction temperature of the TDE1707CFP is 150°C, as specified in the datasheet. It is recommended to keep the junction temperature below 125°C for optimal reliability and performance.
  • While the TDE1707CFP can operate up to 150°C, it is not recommended to use it in high-temperature environments above 125°C without proper thermal management and derating. Consult the datasheet and application notes for guidance on using the device in high-temperature environments.
  • To ensure EMC with the TDE1707CFP, follow the guidelines in the application note AN2679, which provides recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference (EMI). Additionally, ensure that the device is used within its specified operating conditions and that proper filtering and decoupling are implemented.

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TDE1707CFP Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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