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TDE1898CFP - STMicroelectronics

Description: 0.5A high-side driver industrial intelligent power switch

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TDE1898CFP Details

  • Manufacturer Part Number:

    TDE1898CFP

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SO-20

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    9

  • Built-in Protections:

    OVER CURRENT; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.625 A

  • Output Peak Current Limit-Nom:

    0.75 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    18 V

  • Supply Voltage-Nom:

    24 V

  • Supply Voltage1-Max:

    35 V

  • Supply Voltage1-Min:

    9 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    20 µs

  • Turn-on Time:

    100 µs

  • Width:

    7.5 mm

TDE1898CFP Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using thermal interface materials, such as thermal grease or thermal tape, to improve heat transfer between the device and the heat sink.
  • Critical parameters to monitor during device operation include input voltage, output current, junction temperature, and output voltage. Monitoring these parameters helps prevent overheating, overvoltage, and overcurrent conditions that can damage the device.
  • To troubleshoot issues with the TDE1898CFP, start by checking the input voltage, output current, and junction temperature. Verify that the device is operated within the recommended specifications. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • To prevent electrostatic discharge (ESD) damage, handle the device by the body or pins, avoiding direct contact with the die. Use an ESD wrist strap or mat, and ensure that the workspace is ESD-protected. Follow proper PCB design and assembly guidelines to minimize ESD risks.

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TDE1898CFP Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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