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TDES960RTDT - Texas Instruments

Description: Serializers & Deserializers - Serdes 4.16-Gbps MIPI CSI-2 V Link deserializer quad hub for high speed sensors

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TDES960RTDT - Texas Instruments - PCB symbol
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PCB Footprints
TDES960RTDT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - VQFN (64) **
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3D Models
TDES960RTDT - Texas Instruments - 3D model - Quad Flat No-Lead - VQFN (64) **
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TDES960RTDT Details

  • Manufacturer Part Number:

    TDES960RTDT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    1.155 V

  • Supply Voltage-Min (Vsup):

    1.045 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

TDES960RTDT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • To ensure accurate temperature measurement, it's essential to follow proper PCB layout and thermal design guidelines. Additionally, calibrate the device using the CAL pin, and consider using a thermocouple or other temperature reference for high-accuracy applications.
  • The TDES960RTDT can operate from -40°C to 125°C, but the accuracy of the temperature measurement may degrade above 100°C. For high-temperature applications, consider using a thermocouple or other temperature sensors specifically designed for high-temperature ranges.
  • While the TDES960RTDT is a robust device, it's essential to follow proper PCB mounting and attachment guidelines to ensure the device can withstand vibrations and shocks. Consider using a rigid PCB and secure mounting to minimize the risk of mechanical damage.
  • The TDES960RTDT provides a digital output that can be easily interfaced with microcontrollers or other digital systems using a standard I2C or SPI interface. Consult the datasheet for specific interface and communication protocols.

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TDES960RTDT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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