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TDK5110FHTMA1 - Infineon

Description: RF Transmitter CONTROL

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TDK5110FHTMA1 - Infineon - PCB symbol
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TDK5110FHTMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - TDK5110FHTMA1
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TDK5110FHTMA1 - Infineon - 3D model - Small Outline Packages - TDK5110FHTMA1
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TDK5110FHTMA1 Details

  • Manufacturer Part Number:

    TDK5110FHTMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    GREEN, PLASTIC, TSSOP-10

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.021 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

TDK5110FHTMA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure efficient heat dissipation.
  • Ensure proper thermal management, use a heat sink or thermal pad, and follow the recommended PCB layout. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • Exceeding the maximum Tj rating can lead to reduced lifespan, decreased performance, and potentially even device failure. It's essential to ensure the device operates within the specified temperature range to maintain reliability and performance.
  • Yes, but ensure the device is properly secured to the PCB using a suitable mounting method, such as a screw or adhesive, to prevent damage from vibration. Additionally, consider using a vibration-dampening material or a shock-absorbing mounting system.
  • Check the input voltage, output voltage, and current consumption. Verify that the input voltage is within the specified range, and the output voltage is within the expected range. Also, check for any signs of overheating or excessive current draw.

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TDK5110FHTMA1 Overview

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