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TESEO-LIV3F - STMicroelectronics

Description: GPS Modules Tiny GNSS module

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TESEO-LIV3F - STMicroelectronics PCB footprint - Small Outline No-lead - Small Outline No-lead - TESEO-LIV3F
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TESEO-LIV3F - STMicroelectronics - 3D model - Small Outline No-lead - TESEO-LIV3F
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TESEO-LIV3F Details

  • Manufacturer Part Number:

    TESEO-LIV3F

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LCC-18

  • Country Of Origin:

    South Korea

  • ECCN Code:

    7A994

  • Date Of Intro:

    2017-06-20

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • JESD-30 Code:

    R-XDMA-N18

  • JESD-609 Code:

    e4

  • Length:

    10.1 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    2.3 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    NO

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.1 mm

  • Terminal Position:

    DUAL

  • Width:

    9.7 mm

TESEO-LIV3F Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to first apply VCC, then VBAT, and finally enable the GNSS signals. This ensures proper initialization and prevents any potential damage to the device.
  • The TESEO-LIV3F can be configured for different GNSS constellations (e.g., GPS, GLONASS, Galileo, BeiDou) using the SPI interface. The configuration is done by writing specific values to the device's registers. Refer to the application note AN5343 for detailed information.
  • The maximum update rate for the TESEO-LIV3F is 10 Hz. However, the update rate can be adjusted based on the application requirements and power consumption constraints.
  • The thermal shutdown feature is enabled by default. When the device temperature exceeds 85°C, it will shut down to prevent damage. To handle this, ensure proper thermal design and heat dissipation in your system. You can also disable the thermal shutdown feature by writing to the appropriate register.
  • The recommended antenna design for TESEO-LIV3F is a patch antenna or a ceramic antenna with a gain of around 5 dBi. The antenna should be designed to operate at the GNSS frequency bands (e.g., L1, L2, L5). Refer to the application note AN5343 for more information.

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TESEO-LIV3F Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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