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TF412ST5G - onsemi

Description: Low IGSS 1.0nA MAX; Low IDSS 1.2-3.0mA; Ultrasmall package facilitates miniaturization in end products; Halogen free compliance

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Symbol
TF412ST5G - onsemi - PCB symbol
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PCB Footprints
TF412ST5G - onsemi PCB footprint - Other - Other - TF412ST5G-6
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3D Models
TF412ST5G - onsemi - 3D model - Other - TF412ST5G-6
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TF412ST5G Details

  • Manufacturer Part Number:

    TF412ST5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-883

  • Manufacturer Package Code:

    506CB

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Time@Peak Reflow Temperature-Max (s):

    30

TF412ST5G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The maximum allowable voltage stress is 1.5 times the rated voltage (Vr) for a maximum duration of 100 ms. Exceeding this may cause permanent damage.
  • Use a transient voltage suppressor (TVS) or a zener diode to clamp voltage transients. Ensure the device is properly soldered and handled to prevent mechanical stress.
  • Store the device in a dry, cool place (below 30°C and 60% RH) in its original packaging or an anti-static bag to prevent moisture and ESD damage.

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TF412ST5G Overview

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