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TFA9879HN/N1,118 - NXP

Description: Audio Amplifiers ClassD 2.75W 2Channel 1.8V 5.7mA

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PCB Footprints
TFA9879HN/N1,118 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT616-3 (HVQFN24)
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TFA9879HN/N1,118 - NXP  - 3D model - Quad Flat No-Lead - SOT616-3 (HVQFN24)
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TFA9879HN/N1,118 Details

  • Manufacturer Part Number:

    TFA9879HN/N1,118

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    QFN

  • Package Description:

    HVQFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    SOT616-3

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    S-PQCC-N24

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Power-Nom:

    2.75 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    0.02 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

TFA9879HN/N1,118 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Use a 2nd-order LC filter with a cutoff frequency of 100 kHz to 200 kHz. Choose inductors with a high Q-factor and capacitors with low ESR. Optimize the filter component values using simulation tools or impedance analyzers.
  • Use a 10 μF to 22 μF X7R or X5R ceramic capacitor with a voltage rating of 16 V or higher. Ensure the capacitor is placed close to the IC and connected to the input pin with a short, low-impedance path.
  • Monitor the IC's junction temperature, output current, and voltage. Ensure the IC is operated within the recommended voltage range (4.5 V to 18 V) and current limit (2.5 A). Use thermal monitoring and overcurrent protection to prevent damage.
  • Keep high-frequency signals (e.g., clock and data lines) short and away from noisy signals. Use a ground plane and shielded cables to minimize EMI. Route signals in a way that minimizes loop area and reduces radiation.

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TFA9879HN/N1,118 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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