Part Image

TFF1024HN/N1,115 - NXP

Description: Up-Down Converters TFF1024HN/N1/

Download TFF1024HN/N1,115 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
TFF1024HN/N1,115 - NXP PCB footprint - Other - Other - DHVQFN SOT763-1
click to zoom

TFF1024HN/N1,115 Details

  • Manufacturer Part Number:

    TFF1024HN/N1,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    DHVQFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    SOT763-1

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8541.21.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • JESD-30 Code:

    R-PQCC-N16

  • Length:

    3.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.1X.14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    RF AND BASEBAND CIRCUIT

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    2.5 mm

TFF1024HN/N1,115 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a thermal pad or a heat sink to dissipate heat, and ensure good airflow around the device. Also, follow the recommended operating conditions and derating guidelines in the datasheet.
  • Using a different voltage regulator may affect the device's performance and stability. Ensure the regulator provides a stable output voltage within the recommended range (1.71V to 1.89V) and has a low output impedance to minimize noise and ripple.
  • Use a logic analyzer or oscilloscope to monitor the I2C bus signals. Check for proper signal levels, clock frequency, and data transmission. Verify that the device is properly addressed and that the I2C bus is not overloaded.
  • The device has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is properly grounded during handling.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

TFF1024HN/N1,115 Overview

Use the download button to access the TFF1024HN/N1,115 schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like TFF10, or try a keyword search, such as Other Telecom ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to TFF1024HN/N1,115

Showing 0 results