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THP210DR - Texas Instruments

Description: Operational Amplifiers - Op Amps High precision (40- V, 0.1 V/C), high-voltage (36-V), low-noise (3.7-nV/ Hz), fully-differential amp 8-SOIC -40 to 125

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THP210DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A  SOIC
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THP210DR - Texas Instruments  - 3D model - Small Outline Packages - D0008A  SOIC
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THP210DR Details

  • Manufacturer Part Number:

    THP210DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-11-10

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.002 µA

  • Bias Current-Max (IIB) @25C:

    0.002 µA

  • Common-mode Reject Ratio-Min:

    126 dB

  • Common-mode Reject Ratio-Nom:

    140 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.003 µA

  • Input Offset Voltage-Max:

    40 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -2.5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUT LINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    15 V/us

  • Supply Current-Max:

    1.05 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    7000

  • Voltage Gain-Min:

    562341.3252

  • Wideband:

    NO

  • Width:

    3.895 mm

THP210DR Frequently Asked Questions (FAQs)

  • A good PCB layout for the THP210DR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • To ensure proper biasing, follow the recommended biasing circuit in the datasheet, which includes a voltage divider and a decoupling capacitor. Also, ensure the input voltage is within the recommended range (2.7V to 5.5V) and the output is properly terminated.
  • The THP210DR can support data rates up to 100 Mbps, but the actual data rate may be limited by the system's signal integrity, PCB layout, and other factors. TI recommends following the recommended layout and signal integrity guidelines to achieve the highest data rates.
  • The THP210DR has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure the device is properly grounded during handling.
  • The THP210DR is specified to operate from -40°C to 125°C, but the actual operating temperature range may be limited by the system's thermal design and other factors. Ensure proper thermal management and follow TI's recommended thermal design guidelines.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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