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THS1206MDAREP - Texas Instruments

Description: Enhanced Product 12-Bit, 6 Msps Adc Quad Ch. (Config.), Dsp/Up If, Integ. 16X Fifo

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THS1206MDAREP - Texas Instruments - PCB symbol
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THS1206MDAREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DA (R-PDSO-G32)
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THS1206MDAREP - Texas Instruments - 3D model - Small Outline Packages - DA (R-PDSO-G32)
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THS1206MDAREP Details

  • Manufacturer Part Number:

    THS1206MDAREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-32

  • Pin Count:

    32

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Input Voltage-Max:

    5.25 V

  • Analog Input Voltage-Min:

    4.75 V

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e4

  • Length:

    11 mm

  • Linearity Error-Max (EL):

    0.0439%

  • Moisture Sensitivity Level:

    2

  • Number of Analog In Channels:

    4

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP32,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    6 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    40 mA

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

THS1206MDAREP Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS1206MDAREP involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The THS1206MDAREP requires a single 3.3V or 5V power supply. Decoupling capacitors (e.g., 0.1uF and 10uF) should be placed close to the device, with the smaller capacitor connected between the power pin and ground, and the larger capacitor connected between the power pin and a dedicated power plane.
  • The THS1206MDAREP can support data rates up to 1.5 Gbps, depending on the specific application and PCB layout. However, the actual data rate may be limited by the system's signal integrity and noise tolerance.
  • The THS1206MDAREP's output common-mode voltage is set by the VREF pin. The VREF pin should be connected to a voltage divider or a voltage reference circuit to set the desired common-mode voltage. The output common-mode voltage should be within the specified range to ensure proper operation.
  • The THS1206MDAREP requires a 50-ohm termination at the output. A series resistor (e.g., 50 ohms) should be connected in series with the output, and a parallel capacitor (e.g., 10pF) should be connected between the output and ground to ensure proper signal integrity.

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THS1206MDAREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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