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THS2630SDGNR - Texas Instruments

Description: • High performance – Bandwidth: 187MHz (VCC = ±15 V, G = 1 V/V) – Slew rate: 75 V/µs – Gain bandwidth product: 245 MHz – Distortion: –108 dBc THD at 2 VPP, 250 kHz • Voltage noise – 1/f voltage noise corner: 85 Hz – 1.1 nV/√Hz input-referred noise • Single supply operating range: 5 V to 35 V • Quiescent current (shutdown): 770 µA (THS2630S)

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THS2630SDGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - VSSOP - 1.1*
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THS2630SDGNR - Texas Instruments  - 3D model - Small Outline Packages - VSSOP - 1.1*
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THS2630SDGNR Details

  • Manufacturer Part Number:

    THS2630SDGNR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    15.1 µA

  • Bias Current-Max (IIB) @25C:

    9.8 µA

  • Common-mode Reject Ratio-Min:

    81 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1300 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -18.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    75 V/us

  • Supply Current-Max:

    13.2 mA

  • Supply Voltage Limit-Max:

    18.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    245000

  • Voltage Gain-Min:

    17782.79

  • Wideband:

    NO

  • Width:

    3 mm

THS2630SDGNR Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the THS2630SDGNR. TI recommends a 4-layer PCB with a solid ground plane, and to keep the input and output traces as short as possible. Additionally, use a common-mode choke or a ferrite bead to filter out high-frequency noise.
  • The gain resistor values (Rf and Rg) depend on the desired gain and bandwidth. TI provides a gain resistor calculator tool to help with the selection. Generally, a higher gain requires smaller resistor values, but be careful not to compromise stability.
  • The maximum input voltage swing is ±10V, but it's recommended to keep it within ±5V to ensure optimal performance and prevent damage to the device.
  • Yes, the THS2630SDGNR can be used in a single-supply configuration, but it's essential to ensure the input signal is biased around the midpoint of the supply voltage (e.g., Vcc/2) to maintain optimal performance.
  • Use a combination of techniques such as: adding a common-mode choke or ferrite bead, using a pi-filter or a T-filter, and shielding the PCB. Additionally, ensure good PCB layout practices, such as keeping sensitive traces away from noisy areas.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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