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THS3001CDGNR - Texas Instruments

Description: Op Amp Single High Speed Amplifier ±16V/32V 8-Pin HVSSOP EP T/R

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THS3001CDGNR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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THS3001CDGNR - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D
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THS3001CDGNR Details

  • Manufacturer Part Number:

    THS3001CDGNR

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    HVSSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    15 µA

  • Bandwidth (3dB)-Nom:

    350 MHz

  • Bias Current-Max (IIB) @25C:

    10 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    73 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Nom:

    6500 V/us

  • Supply Current-Max:

    9 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD SILVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    420000

  • Wideband:

    YES

  • Width:

    3 mm

THS3001CDGNR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS3001 evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The selection of input and output termination resistors depends on the specific application and signal requirements. TI provides guidelines and calculators in the THS3001 datasheet and application notes to help with resistor selection.
  • The THS3001CDGNR is rated for operation from -40°C to 125°C, but the device's performance and reliability may degrade at extreme temperatures. It's essential to consider the operating temperature range in your design and ensure proper thermal management.
  • To ensure EMC, follow proper PCB design and layout practices, such as using a solid ground plane, minimizing signal loop areas, and using shielding and filtering components as needed. TI also provides EMC guidelines and application notes for the THS3001.
  • A recommended power supply decoupling scheme includes using a combination of ceramic and electrolytic capacitors, with a 10uF ceramic capacitor placed close to the device's power pins and a 10uF electrolytic capacitor placed further away. This helps to filter out noise and ensure stable operation.

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THS3001CDGNR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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