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THS3001HVCDGN - Texas Instruments

Description: 420-MHz Current-Feedback Amplifier

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THS3001HVCDGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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THS3001HVCDGN - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D
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THS3001HVCDGN Details

  • Manufacturer Part Number:

    THS3001HVCDGN

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    HVSSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    15 µA

  • Bandwidth (3dB)-Nom:

    350 MHz

  • Bias Current-Max (IIB) @25C:

    10 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    73 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -18.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Nom:

    6500 V/us

  • Supply Current-Max:

    9 mA

  • Supply Voltage Limit-Max:

    18.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    420000

  • Wideband:

    YES

  • Width:

    3 mm

THS3001HVCDGN Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS3001 evaluation module documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The THS3001 can deliver high output currents, so it's essential to ensure proper heat sinking and thermal management. Use a heat sink with a thermal resistance of less than 10°C/W, and consider using a thermal interface material to improve heat transfer. Additionally, ensure that the PCB traces and vias can handle the high current output.
  • The THS3001 can drive capacitive loads up to 100 nF, but it's recommended to limit the load capacitance to 10 nF or less to ensure stability and prevent oscillations. If a larger capacitive load is required, consider adding a series resistor to dampen the output.
  • The THS3001 has a fixed gain of 2, but you can configure the gain by adding external resistors. Use the gain equation provided in the datasheet to calculate the required resistor values, and ensure that the resistors are precision-matched to maintain accuracy.
  • Use a combination of ceramic and electrolytic capacitors to decouple the power supply. A 10 μF ceramic capacitor and a 10 μF electrolytic capacitor in parallel can provide effective decoupling. Place the capacitors as close as possible to the THS3001 power pins.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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