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THS3062DDAG3 - Texas Instruments

Description: High Speed Operational Amplifiers Hi-Vltg Hi-Slew-Rate Current Feedback

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THS3062DDAG3 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDA (R-PDSO-G8)+
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THS3062DDAG3 - Texas Instruments - 3D model - Small Outline Packages - DDA (R-PDSO-G8)+
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THS3062DDAG3 Details

  • Manufacturer Part Number:

    THS3062DDAG3

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    25 µA

  • Bandwidth (3dB)-Nom:

    210 MHz

  • Bias Current-Max (IIB) @25C:

    25 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    72 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.68 mm

  • Slew Rate-Nom:

    7000 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    20 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    300000

  • Wideband:

    YES

  • Width:

    3.9 mm

THS3062DDAG3 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS3062DDAG3 evaluation module (EVM) user's guide, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The input termination resistors (RIN) should be selected based on the source impedance of the signal and the desired input impedance of the amplifier. A general guideline is to choose RIN = 2 * ZS, where ZS is the source impedance. However, the optimal value may vary depending on the specific application and signal characteristics.
  • The maximum power dissipation of the THS3062DDAG3 is 1.4W. To ensure it does not overheat, the device should be mounted on a PCB with a sufficient thermal pad and heat sink, and the ambient temperature should be kept below 85°C. Additionally, the device's power consumption should be calculated and monitored to prevent overheating.
  • The THS3062DDAG3 has a built-in anti-aliasing filter, but additional filtering may be necessary depending on the specific application. A low-pass filter can be added at the input or output of the amplifier to filter out high-frequency noise and aliasing. The filter design should be based on the signal bandwidth and noise characteristics of the application.
  • Texas Instruments recommends using a 10uF ceramic capacitor in parallel with a 1uF ceramic capacitor for supply bypassing and decoupling. The capacitors should be placed as close as possible to the device's power pins to minimize noise and ensure stable operation.

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THS3062DDAG3 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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