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THS3092DDAR - Texas Instruments

Description: High Speed Operational Amplifiers Dual Hig-Vltg Low Distortion

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THS3092DDAR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDA (R-PDSO-G8)+
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THS3092DDAR Details

  • Manufacturer Part Number:

    THS3092DDAR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    20 µA

  • Bandwidth (3dB)-Nom:

    145 MHz

  • Bias Current-Max (IIB) @25C:

    15 µA

  • Common-mode Reject Ratio-Min:

    68 dB

  • Common-mode Reject Ratio-Nom:

    78 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    15 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Slew Rate-Nom:

    5700 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    21 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    145000

  • Wideband:

    YES

  • Width:

    3.9 mm

THS3092DDAR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS3092DDAR evaluation module (EVM) documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The selection of input and output capacitors depends on the specific application requirements, such as frequency response, noise tolerance, and power supply rejection. TI recommends using X7R or X5R ceramic capacitors with a minimum capacitance of 10uF for input and output filtering, and a maximum ESR of 0.1 ohms.
  • The THS3092DDAR is rated for operation from -40°C to 125°C, but the maximum operating temperature range may vary depending on the specific application and thermal management. It's recommended to consult the datasheet and thermal management guidelines for specific temperature range limitations.
  • To ensure EMC, follow proper PCB layout and design guidelines, use shielding and filtering components, and implement proper grounding and decoupling techniques. Additionally, TI recommends following the IEC 61000-4-2 standard for electrostatic discharge (ESD) protection.
  • The recommended power-up sequence for THS3092DDAR is to apply the power supply voltage (VCC) before applying the input signal. This ensures that the internal biasing and reference circuits are properly initialized before the input signal is applied.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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