SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Packing Method:
TUBE
Peak Reflow Temperature (Cel):
260
Power:
NO
Programmable Power:
NO
Qualification Status:
Not Qualified
Seated Height-Max:
1.1 mm
Slew Rate-Nom:
900 V/us
Subcategory:
Operational Amplifier
Supply Current-Max:
6.5 mA
Supply Voltage Limit-Max:
16.5 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Technology:
BICMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Unity Gain BW-Nom:
100000
Wideband:
YES
Width:
3 mm
THS3110IDGN Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the THS3110EVM evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
The choice of input and output termination resistors depends on the specific application and signal requirements. TI provides guidelines for selecting termination resistors in the THS3110 datasheet and application notes, including considerations for impedance matching, signal attenuation, and noise reduction.
The THS3110IDGN is specified to operate from -40°C to 125°C, but it's essential to consider the derating of the device's performance and reliability at extreme temperatures. Consult the datasheet and reliability reports for more information.
To ensure EMC and EMI compliance, follow proper PCB design and layout practices, use shielding and filtering techniques, and consider the device's electromagnetic susceptibility and emissions characteristics, as outlined in the THS3110 datasheet and application notes.
TI recommends using a combination of ceramic and electrolytic capacitors for power supply decoupling, along with a pi-filter or LC filter to reduce noise and ripple. Consult the THS3110 datasheet and application notes for specific guidelines and examples.
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THS3110IDGN Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
