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THS3122CDDA - Texas Instruments

Description: High Speed Operational Amplifiers Dual High Output Current 120-MHz

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THS3122CDDA - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDA0008B_
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THS3122CDDA Details

  • Manufacturer Part Number:

    THS3122CDDA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    30 µA

  • Bandwidth (3dB)-Nom:

    126 MHz

  • Bias Current-Max (IIB) @25C:

    2 µA

  • Common-mode Reject Ratio-Min:

    63 dB

  • Common-mode Reject Ratio-Nom:

    67 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    22 µA

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.68 mm

  • Slew Rate-Nom:

    1550 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    18 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    138000

  • Wideband:

    YES

  • Width:

    3.9 mm

THS3122CDDA Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THS3122CDDA evaluation module (EVM) user's guide, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The optimal input termination depends on the specific application and signal source. TI provides a termination guide in the THS3122CDDA datasheet, which includes recommendations for different signal sources and impedance matching. Additionally, the THS3122CDDA EVM user's guide provides more detailed information on input termination.
  • The THS3122CDDA is specified to operate from -40°C to 85°C, but it can be operated at temperatures up to 105°C with reduced performance and reliability. However, it's recommended to operate the device within the specified temperature range for optimal performance and reliability.
  • To ensure EMC, follow proper PCB layout and design guidelines, use shielding and filtering as necessary, and ensure that the device is operated within its specified frequency range. Additionally, TI provides EMC guidelines and recommendations in the THS3122CDDA datasheet and EVM user's guide.
  • The recommended power sequencing for the THS3122CDDA is to power up the device in the following order: VCC, VDD, and then the input signal. This ensures that the device is properly biased and configured before the input signal is applied.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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