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THS4031MJGB - Texas Instruments

Description: Op Amp Single High Speed Amplifier ±16V/32V 8-Pin CDIP Tube

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THS4031MJGB - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8
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THS4031MJGB - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8
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THS4031MJGB Details

  • Manufacturer Part Number:

    THS4031MJGB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    8 µA

  • Bandwidth (3dB)-Nom:

    90 MHz

  • Bias Current-Max (IIB) @25C:

    6 µA

  • Common-mode Reject Ratio-Min:

    85 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.25 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    80 V/us

  • Slew Rate-Nom:

    100 V/us

  • Supply Current-Max:

    10 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    200000

  • Voltage Gain-Min:

    28000

  • Wideband:

    YES

  • Width:

    7.62 mm

THS4031MJGB Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS4031MJGB involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • The input capacitor should be a low-ESR ceramic capacitor with a value between 10nF to 100nF. The output capacitor should be a low-ESR ceramic capacitor with a value between 100nF to 1uF. The capacitor values depend on the specific application and the desired filter characteristics.
  • The maximum power dissipation of the THS4031MJGB is 1.4W. However, the actual power dissipation depends on the operating conditions, such as the supply voltage, output current, and ambient temperature. It's essential to calculate the power dissipation and ensure that it's within the safe operating area.
  • To ensure stability, it's essential to follow the recommended PCB layout, choose the right input and output capacitors, and ensure that the device is operated within the recommended operating conditions. Additionally, the THS4031MJGB has a built-in compensation network, but external compensation may be required in some applications.
  • The recommended operating temperature range for the THS4031MJGB is -40°C to 125°C. However, the device can operate up to 150°C, but with reduced performance and reliability.

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THS4031MJGB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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