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THS4561IDGKT - Texas Instruments

Description: Differential Amplifiers Low-power, 60-MHz, wide-supply-range fully differential amplifier 8-VSSOP -40 to 125

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THS4561IDGKT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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THS4561IDGKT - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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THS4561IDGKT Details

  • Manufacturer Part Number:

    THS4561IDGKT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2017-09-12

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.6 µA

  • Bias Current-Max (IIB) @25C:

    0.6 µA

  • Common-mode Reject Ratio-Min:

    95 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    250 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.75 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    YES

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    230 V/us

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage Limit-Max:

    6.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    60000

  • Voltage Gain-Min:

    158489.31

  • Wideband:

    NO

  • Width:

    3 mm

THS4561IDGKT Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS4561IDGKT involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the device close to the signal source. Additionally, it's recommended to use a low-ESR capacitor for the power supply decoupling.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output impedance are matched, and the device is operated within its recommended operating conditions. Additionally, adding a small capacitor (e.g., 10pF) between the output and the inverting input can help improve stability.
  • The maximum power dissipation of the THS4561IDGKT is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the actual operating conditions.
  • Yes, the THS4561IDGKT can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance, and the output impedance is matched to the load impedance to maintain signal integrity.
  • The THS4561IDGKT has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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