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THS4631DR - Texas Instruments

Description: High Speed Operational Amplifiers High Speed FET-Input Op Amp

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THS4631DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-12
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THS4631DR - Texas Instruments  - 3D model - Small Outline Packages - SOIC-12
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THS4631DR Details

  • Manufacturer Part Number:

    THS4631DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.002 µA

  • Bandwidth (3dB)-Nom:

    25 MHz

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Common-mode Reject Ratio-Min:

    86 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0001 µA

  • Input Offset Voltage-Max:

    500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -16.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1000 V/us

  • Supply Current-Max:

    13 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    210000

  • Voltage Gain-Min:

    1780

  • Wideband:

    YES

  • Width:

    3.9 mm

THS4631DR Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS4631DR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • The input capacitor should be a low-ESR ceramic capacitor with a value between 10nF to 100nF. The output capacitor should be a low-ESR ceramic capacitor with a value between 100nF to 1uF. The capacitor values and types may need to be adjusted based on the specific application and operating frequency.
  • The maximum power dissipation of the THS4631DR is 1.4W. However, the actual power dissipation will depend on the operating conditions, such as the input voltage, output current, and ambient temperature. It is recommended to calculate the power dissipation based on the specific application and ensure that the device is properly heat-sinked.
  • To ensure stability, it is recommended to follow the recommended PCB layout, use the recommended input and output capacitors, and ensure that the device is properly decoupled. Additionally, the device should be operated within the recommended operating conditions, and the output should be properly terminated.
  • The THS4631DR is rated for operation up to 125°C. However, the device's performance and reliability may be affected at high temperatures. It is recommended to derate the device's power dissipation and ensure proper heat-sinking to ensure reliable operation in high-temperature environments.

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THS4631DR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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