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THS8200IPFPEP - Texas Instruments

Description: Enhanced Product Triple 10-Bit All Format Video DAC

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THS8200IPFPEP - Texas Instruments - PCB symbol
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THS8200IPFPEP - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PFP (S-PQFP-G80) - TI
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THS8200IPFPEP - Texas Instruments - 3D model - Quad Flat Packages - PFP (S-PQFP-G80) - TI
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THS8200IPFPEP Details

  • Manufacturer Part Number:

    THS8200IPFPEP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    80

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    IT ALSO OPERATES AT 1.8V DIGITAL SUPPLY

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQFP-G80

  • JESD-609 Code:

    e4

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    80

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

THS8200IPFPEP Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS8200 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • The gain resistor values depend on the desired gain and bandwidth. TI provides a gain resistor calculator tool and application notes to help with the selection. A good starting point is to use the recommended values in the datasheet and then adjust based on the specific application requirements.
  • The maximum power dissipation of the THS8200 is 1.4W. To ensure it doesn't overheat, use a heat sink, keep the device away from other heat sources, and ensure good airflow. The thermal pad on the package should be connected to a solid ground plane to help dissipate heat.
  • Use a combination of passive and active filtering techniques. Add capacitors and resistors to filter out high-frequency noise, and consider adding a ferrite bead or common-mode choke to reduce electromagnetic interference (EMI). The THS8200 also has a built-in filter that can be enabled to reduce noise.
  • The recommended input impedance is 50 ohms, and the recommended output impedance is 50 ohms or lower. Impedance matching is critical for optimal performance, and TI provides guidelines for impedance matching in the datasheet and application notes.

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THS8200IPFPEP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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