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THVD1410DGK - Texas Instruments

Description: RS-422/RS-485 Interface IC 3.3-V to 5-V RS-485 transceiver with +/-18-kV IEC ESD protection 8-VSSOP -40 to 125

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THVD1410DGK - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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THVD1410DGK - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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THVD1410DGK Details

  • Manufacturer Part Number:

    THVD1410DGK

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-11-19

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000062 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485-A; TIA-485-A

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    110 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    2.8 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    500 ns

  • Width:

    3 mm

THVD1410DGK Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device. Additionally, ensure that the input and output traces are well-separated to minimize crosstalk.
  • To minimize EMI and high-frequency noise, use a shielded enclosure, and ensure that the THVD1410DGK is placed away from noise sources. Implement proper grounding, decoupling, and filtering techniques. Additionally, consider using a common-mode choke or a ferrite bead to reduce EMI emissions.
  • The THVD1410DGK supports cable lengths up to 100 meters, but this can vary depending on the specific application, cable quality, and signal frequency. It's essential to perform signal integrity analysis and testing to determine the maximum cable length for your specific use case.
  • To ensure reliable operation, follow the recommended operating conditions, and ensure that the device is properly heatsinked. Implement thermal management techniques, such as using a heat sink or a thermal pad, to keep the junction temperature within the specified range.
  • The THVD1410DGK requires a stable power supply with minimal noise and ripple. Use a high-quality power supply with a low output impedance, and ensure that the power supply can deliver the required current. Implement proper decoupling techniques, such as using ceramic capacitors and ferrite beads, to reduce noise and improve power supply rejection.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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