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THVD1452DGSR - Texas Instruments

Description: 3.3-V to 5-V RS-485 transceiver with ±18-kV IEC ESD protection

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THVD1452DGSR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
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THVD1452DGSR - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A
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THVD1452DGSR Details

  • Manufacturer Part Number:

    THVD1452DGSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-11-19

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.0000062 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485-A; TIA-485-A

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    40 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    2.8 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    20 ns

  • Width:

    3 mm

THVD1452DGSR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize EMI.
  • Use a thermal pad or thermal interface material to improve heat dissipation. Ensure good airflow and avoid blocking airflow around the device. Follow the recommended thermal design guidelines.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and use EMI filters or chokes on the input and output lines. Follow good PCB layout practices and use a common-mode choke if necessary.
  • Use a low-pass filter or a ferrite bead on the output to reduce high-frequency noise. Ensure the output capacitor is properly sized and placed close to the device.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, placed as close to the device as possible. Avoid using electrolytic capacitors due to their higher ESR.

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THVD1452DGSR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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