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THVD1500DR - Texas Instruments

Description: 5-V RS-485 transceiver up to 500 kbps with ±8-kV IEC ESD protection

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THVD1500DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008B (SOIC-8)
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THVD1500DR - Texas Instruments  - 3D model - Small Outline Packages - D0008B (SOIC-8)
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THVD1500DR Details

  • Manufacturer Part Number:

    THVD1500DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Malaysia, Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-08-06

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.0001 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    100 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.66 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    350 ns

  • Width:

    3.895 mm

THVD1500DR Frequently Asked Questions (FAQs)

  • A good PCB layout for the THVD1500DR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the device close to the power source. TI provides a recommended layout in the datasheet and application notes.
  • To ensure proper power and decoupling, use a low-ESR capacitor (e.g., 10uF) close to the device's power pins, and add a 1uF capacitor between the input and output pins. Also, ensure the power supply can provide the required current and has a low output impedance.
  • The THVD1500DR can support cable lengths up to 100 meters (328 feet) at a data rate of 1 Gbps, but this may vary depending on the specific application and cable characteristics. It's recommended to consult TI's application notes and perform testing for specific use cases.
  • To troubleshoot issues, start by verifying the PCB layout, power supply, and decoupling. Use oscilloscopes or logic analyzers to inspect the signal quality and data transmission. Consult TI's application notes and datasheet for guidance on signal integrity and data transmission.
  • While the THVD1500DR is designed for point-to-point connections, it can be used in multi-point or daisy-chained configurations with careful design and consideration of signal attenuation, reflections, and data transmission. Consult TI's application notes and perform testing for specific use cases.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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