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THVD1551DGK - Texas Instruments

Description: TEXAS INSTRUMENTS - THVD1551DGK - RS485 TRANSCEIVER, 50MBPS, VSSOP-8

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THVD1551DGK - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK
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THVD1551DGK - Texas Instruments  - 3D model - Small Outline Packages - DGK
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THVD1551DGK Details

  • Manufacturer Part Number:

    THVD1551DGK

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-09-23

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000005 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485-A; TIA-485-A

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    45 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    16 ns

  • Width:

    3 mm

THVD1551DGK Frequently Asked Questions (FAQs)

  • A good PCB layout for the THVD1551DGK involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the device close to the signal source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper powering and decoupling of the THVD1551DGK, use a high-quality, low-ESR capacitor (e.g., 0.1 μF) between the VCC and GND pins, and place it as close to the device as possible. Additionally, use a 1 μF to 10 μF capacitor between the VCC and GND pins for further decoupling.
  • The THVD1551DGK supports cable lengths up to 100 meters (328 feet) at a data rate of 1 Gbps, and up to 50 meters (164 feet) at a data rate of 3 Gbps, assuming a good quality cable with a characteristic impedance of 100 ohms.
  • To troubleshoot issues with the THVD1551DGK, start by verifying the power supply voltage and decoupling, then check the signal integrity and quality of the input signal. Use an oscilloscope to verify the signal waveform and amplitude, and check for any signs of signal degradation or distortion.
  • Yes, the THVD1551DGK can be used in redundant or fault-tolerant systems. The device has a built-in fault detection mechanism that can detect and report faults, allowing the system to switch to a redundant path or take other corrective action.

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THVD1551DGK Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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