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THVD2419DR - Texas Instruments

Description: RS-485 Interface IC 3V-to-5.5V 250Kbps R S-485 transceiver wi

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THVD2419DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - SOIC - 1.75 mm max height
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THVD2419DR - Texas Instruments  - 3D model - Small Outline Packages - SOIC - 1.75 mm max height
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THVD2419DR Details

  • Manufacturer Part Number:

    THVD2419DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    TIA-485A; EIA-485A

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.008 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    1270 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    750 ns

  • Width:

    3.895 mm

THVD2419DR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the THVD2419DR evaluation module documentation, which includes guidelines for component placement, routing, and thermal management. Following this layout can help ensure optimal performance and minimize signal integrity issues.
  • To mitigate high-frequency switching noise, use a combination of techniques such as: 1) proper PCB layout and grounding, 2) adding decoupling capacitors, 3) using a common-mode choke, and 4) implementing EMI shielding. Additionally, consider using a spread-spectrum clocking technique to reduce electromagnetic interference (EMI).
  • The maximum cable length supported by the THVD2419DR depends on the specific application and the type of cable used. As a general guideline, Texas Instruments recommends keeping the cable length below 10 meters for optimal performance. However, longer cable lengths may be possible with proper signal conditioning and termination.
  • To configure the THVD2419DR for redundant or fault-tolerant operation, use the device's built-in features such as dual-channel operation, channel swapping, and fault detection. Additionally, consider implementing external redundancy mechanisms, such as duplicating critical components or using a secondary device as a backup.
  • The THVD2419DR has a high-power dissipation rating, so proper thermal management is crucial. Ensure good airflow around the device, use a heat sink if necessary, and follow Texas Instruments' guidelines for thermal pad connection and PCB thermal design.

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THVD2419DR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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