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THVD2450DR - Texas Instruments

Description: ±70-V fault-protected 3.3-V to 5-V RS-485 transceiver with IEC ESD

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THVD2450DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - SOIC - 1.75 mm max height,.
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THVD2450DR Details

  • Manufacturer Part Number:

    THVD2450DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2019-07-06

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000005 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    80 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    5.6 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    350 ns

  • Width:

    3.895 mm

THVD2450DR Frequently Asked Questions (FAQs)

  • A good PCB layout for the THVD2450DR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • To ensure reliable operation in high-temperature environments, ensure that the device is properly heatsinked, and the junction temperature (TJ) is kept below the maximum rating of 150°C. Also, consider using a thermal pad or heat sink to dissipate heat.
  • To mitigate EMI and RFI, use a shielded enclosure, keep the device away from antennas and other EMI sources, and use EMI filters or chokes on the input and output lines. Additionally, ensure that the PCB layout is optimized for minimal radiation.
  • To troubleshoot issues with the THVD2450DR, start by checking the input voltage, output load, and PCB layout. Use an oscilloscope to measure the output voltage and current, and check for signs of oscillation or ringing. Consult the datasheet and application notes for troubleshooting guides and FAQs.
  • When using the THVD2450DR in a system with multiple power domains, ensure that the device is properly isolated from other power domains using isolation transformers or optocouplers. Also, consider using a common ground plane to minimize noise and ensure reliable operation.

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THVD2450DR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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