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THVD2452VDR - Texas Instruments

Description: 1/1 Transceiver Full RS422, RS485 14-SOIC

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THVD2452VDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G14)
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3D Models
THVD2452VDR - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G14)
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THVD2452VDR Details

  • Manufacturer Part Number:

    THVD2452VDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    60 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    5.6 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    58 ns

  • Width:

    3.9 mm

THVD2452VDR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAUH5, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal management guidelines in the datasheet, including providing adequate heat sinking and airflow. Additionally, consider using thermal interface materials and thermal vias to improve heat dissipation.
  • When using THVD2452VDR in a system with multiple voltage domains, it is crucial to ensure that the device is properly powered and that the voltage domains are properly isolated to prevent voltage conflicts and ensure reliable operation. This may require the use of level shifters, voltage translators, or other isolation techniques.
  • To troubleshoot issues with THVD2452VDR, start by reviewing the datasheet and application notes to ensure that the device is properly configured and powered. Use oscilloscopes and logic analyzers to monitor the device's inputs and outputs, and check for any signs of electrical overstress or damage. If the issue persists, consider consulting with Texas Instruments' technical support or seeking assistance from a qualified engineer.
  • When using THVD2452VDR in a system with high-speed signals or high-frequency noise, it is essential to ensure that the device is properly shielded and that the PCB layout is designed to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI). This may require the use of shielding, filtering, or other noise-reduction techniques.

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THVD2452VDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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