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THVD2452VDREP - Texas Instruments

Description: Enhanced: 3V to 5.5V, 50Mbps, full-duplex RS-485 transceiver, with flexible IO and 70V bus-fault<

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THVD2452VDREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0014A
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THVD2452VDREP - Texas Instruments  - 3D model - Small Outline Packages - D0014A
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THVD2452VDREP Details

  • Manufacturer Part Number:

    THVD2452VDREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.008 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    60 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    5.6 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    30 ns

  • Width:

    3.9 mm

THVD2452VDREP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed design practices, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliable operation over the entire operating temperature range (-40°C to 125°C), it's crucial to follow proper thermal management practices, such as providing adequate heat sinking, using thermal vias, and ensuring good airflow around the device. Additionally, it's recommended to operate the device within the specified power dissipation limits.
  • Operating the THVD2452VDREP at a lower supply voltage than the recommended 3.3V may result in reduced performance, increased power consumption, and potential reliability issues. Operating at a higher supply voltage may result in increased power consumption, heat generation, and potentially reduced reliability. It's recommended to operate the device within the specified supply voltage range.
  • To troubleshoot issues with signal integrity or data transmission errors, it's recommended to use oscilloscopes or logic analyzers to monitor the signal quality and transmission patterns. Additionally, checking the PCB layout, signal routing, and termination schemes can help identify potential issues. It's also recommended to consult the datasheet and application notes for guidance on signal integrity and data transmission.
  • The THVD2452VDREP has built-in ESD protection and latch-up prevention measures, including internal ESD diodes and latch-up protection circuits. However, it's still recommended to follow proper ESD handling and storage procedures to prevent damage to the device. Additionally, it's recommended to use ESD protection devices, such as TVS diodes, in the system design to provide additional protection.

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THVD2452VDREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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