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TIBPAL16L8-15MJ - Texas Instruments

Description: IC HP IMPACT PAL 20 DIP

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TIBPAL16L8-15MJ - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - J (R-GDIP-T20)*9/
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TIBPAL16L8-15MJ Details

  • Manufacturer Part Number:

    TIBPAL16L8-15MJ

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    DIP

  • Pin Count:

    20

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.31.00.75

  • Date Of Intro:

    1989-08-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Architecture:

    PAL-TYPE

  • In-System Programmable:

    NO

  • JESD-30 Code:

    R-GDIP-T20

  • JESD-609 Code:

    e0

  • JTAG BST:

    NO

  • Length:

    24.195 mm

  • Number of Dedicated Inputs:

    10

  • Number of I/O Lines:

    6

  • Number of Inputs:

    16

  • Number of Outputs:

    8

  • Number of Product Terms:

    64

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    10 DEDICATED INPUTS, 6 I/O

  • Output Function:

    COMBINATORIAL

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Programmable Logic Type:

    OT PLD

  • Propagation Delay:

    15 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    TTL

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

TIBPAL16L8-15MJ Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a thermal pad on the bottom of the package, connected to a solid copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
  • To ensure signal integrity, use controlled impedance traces, and follow the recommended routing guidelines for high-speed signals. Also, use termination resistors and decoupling capacitors as recommended in the datasheet to minimize signal reflections and noise.
  • The TIBPAL16L8-15MJ is rated for operation from -40°C to 125°C. However, it's recommended to derate the device's performance and power consumption at higher temperatures to ensure reliable operation.
  • The TIBPAL16L8-15MJ is not specifically designed or tested for radiation-hardened applications. If you need a radiation-hardened device, consider using a different part from Texas Instruments' radiation-hardened product line.
  • The recommended power-up sequence is to apply VCC first, followed by VPP, and then the input signals. This ensures that the device powers up correctly and minimizes the risk of latch-up or damage.

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TIBPAL16L8-15MJ Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image TIBPAL16L8-15MWB Texas Instruments

OT PLD, 15ns, PAL-Type, TTL, CDFP20

Part Image PAL16L8BCJ AMD

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Part Image TIBPAL16L8-15CFN Texas Instruments

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Part Image 5962-85155092A Signetics

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Part Image 5962-8515509SX Texas Instruments

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For a full list of alternate parts for TIBPAL16L8-15MJ, check out Findchips.com