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TIL111M - onsemi

Description: UL recognized (File #E90700); Add option V for white package (e.g., TIL111VM); VDE recognized (File #94766); (File #102497 for white package)

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TIL111M - onsemi - PCB symbol
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PCB Footprints
TIL111M - onsemi PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - TIL111M
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TIL111M - onsemi - 3D model - Dual-In-Line Packages - TIL111M
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TIL111M Details

  • Manufacturer Part Number:

    TIL111M

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PDIP-6

  • Package Description:

    DIP-6

  • Manufacturer Package Code:

    646BX

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    30 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    50%

  • Current Transfer Ratio-Nom:

    50%

  • Dark Current-Max:

    50 nA

  • Forward Current-Max:

    0.06 A

  • Forward Voltage-Max:

    1.5 V

  • Isolation Voltage-Max:

    4170 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Elements:

    1

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TUBE

  • Power Dissipation-Max:

    0.15 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

TIL111M Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system.
  • A ceramic capacitor with a value of 10uF to 22uF is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize noise and ensure stable operation.
  • Use a TVS (Transient Voltage Suppressor) diode or a zener diode to protect the device from voltage transients. Additionally, consider using a current limiting resistor or a fuse to prevent overcurrent conditions.
  • Keep the input and output traces as short as possible and separate them from each other. Use a ground plane to reduce noise and EMI. Avoid running sensitive traces near the device's switching nodes.

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TIL111M Overview

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