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TJA1128ETK/0Z - NXP

Description: NXP - TJA1128ETK/0Z - System Basis Chip, LIN Protocol, ISO 17987-4, LIN 2.0/2.1/2.2/2.2A Standards, 5V to 28V, HVSON-20

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Symbol
TJA1128ETK/0Z - NXP - PCB symbol
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PCB Footprints
TJA1128ETK/0Z - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - HVSON14
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3D Models
TJA1128ETK/0Z - NXP - 3D model - Small Outline No-lead - HVSON14
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TJA1128ETK/0Z Details

  • Manufacturer Part Number:

    TJA1128ETK/0Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HVSON-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    SYSTEM BASIS CHIP

  • JESD-30 Code:

    R-PDSO-N14

  • JESD-609 Code:

    e4

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC14,.12,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    4.2 mA

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TJA1128ETK/0Z Frequently Asked Questions (FAQs)

  • A good PCB layout for the TJA1128ETK/0Z involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces connected to the high-frequency pins. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure EMC, use a shielded enclosure, keep the TJA1128ETK/0Z away from high-frequency sources, and use a common-mode choke or ferrite bead on the CAN bus lines. Also, ensure that the PCB layout is optimized for EMC.
  • The maximum cable length supported by the TJA1128ETK/0Z is 40 meters, assuming a transmission rate of 1 Mbps and a cable with a characteristic impedance of 120 ohms.
  • To troubleshoot CAN bus issues, use a CAN bus analyzer to monitor the bus traffic, check the termination resistors, and verify that the TJA1128ETK/0Z is properly configured and powered. Also, check for electromagnetic interference (EMI) and ensure that the PCB layout is correct.
  • Yes, the TJA1128ETK/0Z can be used in a fault-tolerant CAN bus system. The device has built-in fault-tolerant features, such as bus fault detection and reporting, and can be used in conjunction with other fault-tolerant devices to create a robust CAN bus system.

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TJA1128ETK/0Z Overview

Use the download button to access the TJA1128ETK/0Z schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TJA11, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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