TK65G10N1 footprint, schematic symbol and 3D model by Toshiba

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TK65G10N1 - Toshiba PCB footprint - Other - Other - TK65G10N1-2

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Datasheet Download Datasheet
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Part Number TK65G10N1
Manufacturer Toshiba
Pin Count 3
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - TK65G10N1-2
Released Date Jan 15, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

TK65G10N1 Details

Manufacturer Part Number:
TK65G10N1
Part Life Cycle Code:
End Of Life
Package Description:
D2PAK-3/2
ECCN Code:
EAR99
Manufacturer:
Toshiba America Electronic Components
YTEOL:
0.4
Avalanche Energy Rating (Eas):
93 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
100 V
Drain Current-Max (ID):
100 A
Drain-source On Resistance-Max:
0.0045 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
42 pF
JESD-30 Code:
R-PSSO-G2
Number of Elements:
1
Number of Terminals:
2
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
156 W
Pulsed Drain Current-Max (IDM):
283 A
Surface Mount:
YES
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

TK65G10N1 Frequently Asked Questions (FAQs)

Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 150°C. Also, ensure proper PCB design and layout to minimize thermal resistance.
Although not specified in the datasheet, Toshiba recommends limiting voltage transients to ±10% of the rated voltage to prevent damage or malfunction.
Yes, the TK65G10N1 is qualified for automotive and high-reliability applications, but additional testing and validation may be required to meet specific industry standards.
Implement ESD protection measures, such as TVS diodes or ESD protection ICs, to prevent damage from electrostatic discharge. Follow proper handling and storage procedures to minimize ESD risks.

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