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TL16CP554AIPM - Texas Instruments

Description: ASYNCHRONOUS-COMMUNICATIONS ELEMENT

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PCB Footprints
TL16CP554AIPM - Texas Instruments PCB footprint - Other - Other - QFP50P1200X1200X160-64N
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3D Models
TL16CP554AIPM - Texas Instruments  - 3D model - Other - QFP50P1200X1200X160-64N
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TL16CP554AIPM Details

  • Manufacturer Part Number:

    TL16CP554AIPM

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Pin Count:

    64

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 5 V SUPPLY

  • Address Bus Width:

    3

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    16 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    0.125 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e4

  • Length:

    10 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Current-Max:

    50 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

TL16CP554AIPM Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • To ensure signal integrity, use controlled impedance traces, minimize trace lengths, and use termination resistors as needed. Also, follow the recommended layout guidelines in the datasheet to minimize crosstalk and electromagnetic interference (EMI).
  • The recommended power-up sequence is to apply VCC first, followed by VDD, and then the input signals. This ensures that the internal voltage regulators are powered up correctly and prevents damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect the device from electrostatic discharge. Follow the recommended ESD protection circuit in the datasheet or application notes.
  • The maximum operating temperature range for the TL16CP554AIPM is -40°C to 125°C. However, the device may not operate within specifications at the extreme temperatures, and thermal derating may be necessary.

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TL16CP554AIPM Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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