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TL16CP554APM - Texas Instruments

Description: ASYNCHRONOUS-COMMUNICATIONS ELEMENT

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PCB Footprints
TL16CP554APM - Texas Instruments PCB footprint - Other - Other - QFP50P1200X1200X160-64N
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3D Models
TL16CP554APM - Texas Instruments  - 3D model - Other - QFP50P1200X1200X160-64N
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TL16CP554APM Details

  • Manufacturer Part Number:

    TL16CP554APM

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    LFQFP-64

  • Pin Count:

    64

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 5 V SUPPLY

  • Address Bus Width:

    3

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    16 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    0.125 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e4

  • Length:

    10 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Current-Max:

    50 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

TL16CP554APM Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling. Additionally, ensure that the input and output traces are short and direct to reduce signal degradation.
  • The TL16CP554APM has a thermal pad on the bottom of the package, which should be connected to a solid ground plane or a thermal relief pattern on the PCB to dissipate heat efficiently. Ensure good airflow around the device, and consider using a heat sink or thermal interface material if the device will be operating in high-temperature environments.
  • The TL16CP554APM requires proper input and output termination to ensure signal integrity. For the input, use a 50-ohm termination resistor to match the impedance of the signal source. For the output, use a 50-ohm back-termination resistor to prevent signal reflections. Additionally, consider using a series resistor and capacitor to filter out high-frequency noise.
  • To minimize power consumption, ensure that the device is operated within the recommended voltage range (2.7V to 3.6V). Use the power-down mode (PD pin) to disable the device when not in use. Additionally, consider using a low-dropout regulator (LDO) to regulate the supply voltage and reduce power consumption.
  • Common pitfalls to avoid include not following the recommended PCB layout, not providing adequate power supply decoupling, and not properly terminating the input and output signals. Additionally, ensure that the device is operated within the recommended temperature range (-40°C to 85°C) and avoid exceeding the maximum ratings for voltage, current, and power dissipation.

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TL16CP554APM Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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