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TL3474AIPWR - Texas Instruments

Description: Dual improved offset, high-slew-rate, single-supply operational amplifier

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TL3474AIPWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G14)
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TL3474AIPWR - Texas Instruments  - 3D model - Small Outline Packages - PW (R-PDSO-G14)
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TL3474AIPWR Details

  • Manufacturer Part Number:

    TL3474AIPWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    14

  • Country Of Origin:

    Mainland China, Malaysia, Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.7 µA

  • Bias Current-Max (IIB) @25C:

    0.5 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    97 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.075 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Min:

    8 V/us

  • Slew Rate-Nom:

    10 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    18 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    4000

  • Voltage Gain-Min:

    20000

  • Wideband:

    NO

  • Width:

    4.4 mm

TL3474AIPWR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TL3474AIPWR involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the output capacitor has a low equivalent series resistance (ESR) and a high ripple current rating. A minimum output capacitance of 10uF is recommended.
  • The TL3474AIPWR has an operating ambient temperature range of -40°C to 125°C. However, the device's junction temperature should not exceed 150°C to ensure reliable operation.
  • Yes, the TL3474AIPWR is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is suitable for use in harsh environments.
  • The power dissipation of the TL3474AIPWR can be calculated using the formula: Pd = (Vin - Vout) x Iout x Efficiency. The efficiency of the device can be obtained from the datasheet or the TI website.

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TL3474AIPWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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