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TL4050B50IDBZR - Texas Instruments

Description: Precision Micropower Shunt Voltage Reference

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TL4050B50IDBZR - Texas Instruments - PCB symbol
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PCB Footprints
TL4050B50IDBZR - Texas Instruments PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - DBZ0003A height 1.12
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TL4050B50IDBZR - Texas Instruments - 3D model - SOT23 (3-Pin) - DBZ0003A height 1.12
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TL4050B50IDBZR Details

  • Manufacturer Part Number:

    TL4050B50IDBZR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China, Malaysia, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    TWO TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    5.01 V

  • Output Voltage-Min:

    4.99 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    50 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.2%

  • Width:

    1.3 mm

TL4050B50IDBZR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a thermal pad on the bottom of the package, connected to a copper plane on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to the copper plane.
  • To ensure reliable startup, a capacitor (typically 10nF to 100nF) should be placed between the VIN pin and GND. This capacitor helps to filter out noise and ensure a clean startup. Additionally, a soft-start circuit can be implemented to limit the inrush current during startup.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the device. It's recommended to use a voltage divider or a buffer circuit to ensure the EN pin voltage remains within the specified range.
  • The output voltage ripple can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency. A lower ESL and higher Cout can help reduce the output voltage ripple.
  • A low-ESR ceramic capacitor (X5R or X7R dielectric) with a value of 10uF to 22uF is recommended for the input capacitor. This helps to filter out noise and ensure a stable input voltage.

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TL4050B50IDBZR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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