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TLC2254AIDR - Texas Instruments

Description: Texas Instruments TLC2254AIDR, Quad Op Amp, 0.2MHz CMOS, Rail to Rail, 5 V, 9 V, 12 V, 15 V, 14-Pin SOIC

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TLC2254AIDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G14)
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TLC2254AIDR - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G14)
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TLC2254AIDR Details

  • Manufacturer Part Number:

    TLC2254AIDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia, Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.001 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    83 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    850 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.05 V/us

  • Slew Rate-Nom:

    0.12 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.25 mA

  • Supply Voltage Limit-Max:

    8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    200

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLC2254AIDR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of TLC2254AIDR is 670mW at 25°C free-air temperature, and it can be calculated using the formula: Pd = (TJ - TA) / θJA, where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance.
  • To ensure stability, it is recommended to use a minimum gain of 5, and to avoid capacitive loads. Additionally, a 10nF to 100nF capacitor can be added between the output and the inverting input to improve stability.
  • To minimize noise and ensure optimal performance, it is recommended to keep the input traces short and away from noise sources, use a ground plane, and keep the output traces away from the input traces. Additionally, decoupling capacitors should be placed close to the power pins.
  • Yes, TLC2254AIDR can operate in a high-temperature environment, but the maximum junction temperature should not exceed 150°C. It is recommended to derate the power dissipation accordingly to ensure reliable operation.
  • To handle ESD protection, it is recommended to use a human-body model (HBM) ESD protection circuit, and to follow proper handling and storage procedures to prevent ESD damage.

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TLC2254AIDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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