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TLC2262AMJGB - Texas Instruments

Description: Op Amp Dual Low Noise Amplifier R-R O/P ±8V/16V 8-Pin CDIP Tube

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TLC2262AMJGB - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8)_
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TLC2262AMJGB Details

  • Manufacturer Part Number:

    TLC2262AMJGB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0008 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    83 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0008 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Neg Supply Voltage Limit-Max:

    -8 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    38535V;38534K;883S

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    0.25 V/us

  • Slew Rate-Nom:

    0.55 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.5 mA

  • Supply Voltage Limit-Max:

    8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    710

  • Voltage Gain-Min:

    50000

  • Wideband:

    NO

  • Width:

    7.62 mm

TLC2262AMJGB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends following a star-grounding scheme, keeping analog and digital grounds separate, and using a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce capacitive coupling.
  • It is recommended to power up the VCC pin before the VIN pin, and power down the VIN pin before the VCC pin. This ensures that the internal circuitry is properly initialized and avoids any potential damage or unexpected behavior.
  • The TLC2262AMJGB can drive a maximum capacitive load of 1000 pF. Exceeding this limit can cause instability or oscillations in the output. It is recommended to use a series resistor to dampen the capacitive load and ensure stability.
  • The TLC2262AMJGB has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) mechanisms. The OVP circuitry limits the output voltage to a maximum of 15.5V, while the UVLO circuitry disables the output when the input voltage falls below 2.7V.
  • The TLC2262AMJGB has a thermal derating of 13.3 mW/°C above 25°C. This means that the maximum power dissipation decreases as the ambient temperature increases. It is essential to ensure that the device is properly heat-sinked and operated within the recommended temperature range to prevent overheating.

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TLC2262AMJGB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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