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TLC27L4IDG4 - Texas Instruments

Description: TEXAS INSTRUMENTS - TLC27L4IDG4 . - Operational Amplifier, Quad, 4 Amplifier, 85 kHz, 0.03 V/µs, 4V to 16V, SOIC, 14 Pins

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TLC27L4IDG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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TLC27L4IDG4 - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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TLC27L4IDG4 Details

  • Manufacturer Part Number:

    TLC27L4IDG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, SO-14

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    1989-03-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.002 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    94 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.02 V/us

  • Slew Rate-Nom:

    0.03 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.172 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    85

  • Voltage Gain-Min:

    50000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLC27L4IDG4 Frequently Asked Questions (FAQs)

  • The maximum power dissipation of TLC27L4IDG4 is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and thermal resistance (RθJA) of 125°C/W.
  • To ensure stability, it is recommended to use a minimum gain of 7, and to avoid capacitive loads greater than 100pF. Additionally, a 0.1μF bypass capacitor should be placed between the VCC pin and ground to reduce noise and oscillations.
  • The input impedance of TLC27L4IDG4 is typically around 10^12 ohms, making it suitable for high-impedance sources and minimizing the loading effect on the input signal.
  • While TLC27L4IDG4 can be used as a comparator, it is not recommended due to its op-amp architecture and limited output current capability. Texas Instruments recommends using a dedicated comparator like the LM339 or LM2901 for comparator applications.
  • TLC27L4IDG4 has built-in ESD protection, but it is still recommended to follow proper handling and storage procedures to prevent ESD damage. Additionally, using ESD protection devices like TVS diodes or ESD arrays can provide extra protection in high-risk environments.

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TLC27L4IDG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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