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TLE2022MJGB - Texas Instruments

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TLE2022MJGB - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8
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TLE2022MJGB Details

  • Manufacturer Part Number:

    TLE2022MJGB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.09 µA

  • Bias Current-Max (IIB) @25C:

    0.07 µA

  • Common-mode Reject Ratio-Min:

    85 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.006 µA

  • Input Offset Voltage-Max:

    600 µV

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    0.4 V/us

  • Slew Rate-Nom:

    0.5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.6 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1700

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    7.62 mm

TLE2022MJGB Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLE2022MJGB involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input traces. Additionally, it's recommended to use a low-ESR capacitor for the power supply decoupling.
  • To ensure the TLE2022MJGB operates within its recommended operating conditions, verify that the input voltage is within the specified range (2.7V to 36V), the operating temperature is within the specified range (-40°C to 125°C), and the output current does not exceed the maximum rating (2A).
  • When using the TLE2022MJGB, it's essential to consider thermal management to prevent overheating. Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pad on the bottom of the package.
  • To troubleshoot issues with the TLE2022MJGB, start by verifying the input voltage and current, checking for proper PCB layout and decoupling, and ensuring the device is operating within its recommended operating conditions. Use an oscilloscope to monitor the output voltage and current, and check for any signs of overheating or electrical overstress.
  • Yes, when using the TLE2022MJGB, it's essential to consider EMI/EMC. Use a shielded enclosure, keep the device away from high-frequency sources, and ensure proper grounding and shielding of the PCB. Additionally, use EMI filters or common-mode chokes to reduce electromagnetic interference.

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TLE2022MJGB Overview

Use the download button to access the TLE2022MJGB schematic symbol, PCB footprint, and 3D model.
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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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