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TLE2027AMJGB - Texas Instruments

Description: OP Amp Single GP ±19V 8-Pin CDIP Tube

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TLE2027AMJGB - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG  (R-GDIP-T8)
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TLE2027AMJGB - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - JG  (R-GDIP-T8)
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TLE2027AMJGB Details

  • Manufacturer Part Number:

    TLE2027AMJGB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.15 µA

  • Bias Current-Max (IIB) @25C:

    0.09 µA

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    131 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.09 µA

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -19 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    2.8 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    5.6 mA

  • Supply Voltage Limit-Max:

    19 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    13000

  • Voltage Gain-Min:

    8000000

  • Wideband:

    NO

  • Width:

    7.62 mm

TLE2027AMJGB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using decoupling capacitors.
  • The TLE2027AMJGB has a thermal pad on the bottom of the package, which should be connected to a solid ground plane or a thermal relief pattern on the PCB to dissipate heat. Additionally, ensure good airflow around the device and consider using a heat sink if necessary.
  • The recommended input and output termination for the TLE2027AMJGB is 50 ohms, with a series resistor and shunt capacitor at the input and output pins, respectively, to match the impedance and minimize reflections.
  • The TLE2027AMJGB requires a dual power supply (±5V or ±15V) and a bias voltage (VCC) of 5V or 15V, depending on the application. Ensure that the bias voltage is stable and well-regulated, and that the input and output signals are properly AC-coupled or DC-coupled as required.
  • Common failure modes of the TLE2027AMJGB include overheating, overvoltage, and electrostatic discharge (ESD). To prevent these, ensure proper thermal management, use voltage regulators and protection diodes, and follow proper ESD handling and storage procedures.

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TLE2027AMJGB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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