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TLE2072MJGB - Texas Instruments

Description: Military-grade, dual, 38-V, 10-MHz, 40-V/μs slew rate, In to V+, JFET-input op amp

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TLE2072MJGB - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - JG (R-GDIP-T8),
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TLE2072MJGB Details

  • Manufacturer Part Number:

    TLE2072MJGB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.06 µA

  • Bias Current-Max (IIB) @25C:

    0.000175 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    98 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0001 µA

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-GDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.58 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -19 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    18 V/us

  • Slew Rate-Nom:

    40 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    3.9 mA

  • Supply Voltage Limit-Max:

    19 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIFET

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    7900

  • Wideband:

    NO

  • Width:

    7.62 mm

TLE2072MJGB Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLE2072MJGB is dependent on the package type and thermal resistance. For the MJGB package, the maximum power dissipation is approximately 1.4W at 25°C ambient temperature, assuming a thermal resistance of 90°C/W.
  • To ensure stability in a unity-gain buffer configuration, it's essential to add a capacitor (typically 10-100nF) between the output and the inverting input to prevent oscillations. Additionally, ensure that the layout is well-designed, with minimal parasitic capacitance and inductance.
  • The recommended input impedance for the TLE2072MJGB is greater than 1kΩ to ensure optimal performance and minimize input bias current effects. However, the input impedance can be lower if the source impedance is matched to the op-amp's input impedance.
  • While the TLE2072MJGB can be used as a comparator, it's not the most suitable choice due to its relatively slow slew rate (0.5V/μs) and limited output current drive capability. A dedicated comparator like the LM339 or TLC339 would be a better option for most applications.
  • To handle ESD protection, ensure that the PCB layout includes ESD protection diodes (e.g., 1N4148) between the input pins and the power supply rails. Additionally, follow proper handling and storage procedures to prevent ESD damage during manufacturing and assembly.

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TLE2072MJGB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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